I-660NM Red LED Chip 5730 I-SMD LED

I-660NM LED isho ukukhanya okukhipha i-diode eno-660NM wavethth. Kepha lapho sinciphisa cishe i-660nm eholwa, imayelana ne-wavelength ephakeme. Futhi ngakunye kwalandiswa okukodwa kube nomhlaba wawo. I-batch ephelele ye-Red SMD LED ngo-660NM. Kuzoba nobubanzi kukho. Kulesi 5730fr668l14p2, ibanga lingu-665NM liye ku-670nm. Amalambu we-665NM axhumeke kakhulu asetshenziswa kaningi ku-LED akhula amalambu. Le wavelength ethile iwela ngaphakathi kwe-red spectrum futhi yaziwa ukuthuthukisa izithombe ze-photosynthesis nasezimbali ezitshalweni. Kuyasiza ekuhlolweni kwamandla okukhanya adingekayo ekukhuleni kwezitshalo nentuthuko. Ngakho-ke, amalambu aholwa ama-665n asetshenziswa kabanzi ekulimaleni engadini yangaphakathi nasekulimaleni kwezohwebo kokuhlakulela izinhlobo ezahlukahlukene zezitshalo.

Izimo Zokugcina:

1. Gwema ukuvezwa okuqhubekayo endaweni evumelana nomswakama futhi ugcine umkhiqizo usuka kude nezinguquko ezisheshayo ekushiseni okukhona;

2. Ama-LED kufanele agcinwe ngokushisa ≤30 ℃ kanye nomswakama ohlobene <60% ℃;

3. Umkhiqizo ephaketheni lokuqala elivaliwe kunconyelwa ukuthi lihlanganiswe kungakapheli amahora angama-72 okuvulwa;

4. Umkhiqizo kwiphakheji elivuliwe isikhathi esingaphezu kwesonto kufanele ubhokwe amahora angama-6-8 ku-85-10 ℃;

Indlela Yokukhuphuka Kwe-LED

1, ukuhola komholi we-LED kumele kuhambisane nokuphindwa kwezimbobo ezikhuphukayo kwi-PCB ngesikhathi sokubekwa kwengxenye;

Ukuqanjwa kokuhola kungadingeka ukuze kuqinisekiswe ukuthi iphimbo lokuhola lifane ne-hole pitch;

Bhekisa kwisibalo esingezansi ukuze uthole izinqubo ezifanele zokwakha;

Ungahambisanga umkhondo we-PCB endaweni yokuxhumana phakathi kwe-Loveframe ne-PCB ukuvikela ama-short-circu amafushane;

Kuphawuliwe:

○ indlela yokufaka efanele;

× indlela yokufaka engalungile;

2. Lapho izintambo zombumbulu eziholwa ku-LED, i-wire ngayinye ijoyinti kufanele ifakwe ngokuhlukile ngeshubhu elishisayo lokushisa ukuvikela ukuxhumana okufushane kwesizungu.

Musa ukunxuselisa zombili izintambo ku-tube eyodwa yokushisa shrink ukugwema ukuncipha okuholela kwe-LED;

Ukuncipha kwengcindezi ku-Led Lead kungalimaza izakhiwo zangaphakathi futhi kubangele ukwehluleka;

Kuphawuliwe:

○ indlela yokufaka efanele;

× indlela yokufaka engalungile;

3. Sebenzisa ama-Stand-offs (Fig 3) noma ama-spacers (Fig 4) ukubeka ngokuphepha i-LED ngenhla kwe-PCB;

4. Gcina ubuncane bokuvulwa kwe-3mm phakathi kwesisekelo selensi ye-LED kanye ne-bend yokuqala yokuhola (Umdwebo 5. Fig. 6)

5. Ngesikhathi sokuhola ukwakha, sebenzisa amathuluzi noma ama-jigs ukubamba okuphephile ukuze amandla okugoba angadluliselwa kwilensi ye-LED kanye nezinhlaka zangaphakathi zangaphakathi;

Ungenzi ukwakheka kokuhola uma isakhi sifakwe kwi-PCB;

L izinqubo ezakha izinqubo

1. Hola izinqubo zokwakha;

2. Musa ukugoba okuholela ngaphezu kokubili (Fig. 7);

3. Ngesikhathi sokuthengisa, izembozo zezakhi kanye nabanikazi kufanele zishiye imvume ukuze zigweme ukubeka ukucindezela okulimazayo ku-LED ngesikhathi sokuthengisa (Umdwebo 8);

4. Ithiphu yensimbi yokuthengisa ye-soldering akufanele ithinte i-lens epoxy;

5. Ngokuhamba nge-leds-hole ahlukene ayihambelani ne-Reflew Soldering;

6. Uma i-LED izodlula i-soldering eminingi noma ibhekane nezinye izinqubo lapho ingxenye ingahle ibekwe khona ekushiseni okukhulu sicela uhlole nge-LED engcono kakhulu yokuhambisana;